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STM32H747ZI产品参数_产品符号_原装销售

IC先生 网络 70 2023-12-21 08:32:28

概述

STM32H747xI/G器件基于Arm的高性能

®

皮质

®

-M7和皮质

®

-M4 32位RISC内核。

®

-M7核心的工作频率高达480mhz和Cortex

®

-M4核心高达240兆赫。

®

单精度和双精度(皮质

®

-M7核心)操作和转换(IEEE 754兼容),包括一整套DSP指令和内存保护单元(MPU),以增强应用程序的安全性。

STM32H747xI/G器件采用高速嵌入式存储器,具有高达2mb的双银行闪存,高达1mb的RAM(包括192kb的TCM RAM,高达864kb的用户SRAM和4kb的备份SRAM),以及广泛的增强型I/ o和外设,连接到APB总线,AHB总线,2x32位多AHB总线矩阵和支持内部和外部存储器访问的多层AXI互连。

所有器件提供三个adc,两个dac,两个超低功耗比较器,一个低功耗RTC,一个高分辨率定时器,12个通用16位定时器,两个用于电机控制的PWM定时器,五个低功耗定时器,一个真正的随机数发生器(RNG)。

STM32H747ZI符号图

STM32H747ZI

STM32H747ZI功能参数

  • Includes ST state-of-the-art patented technology
  • Dual core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator) for internal flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 2 Mbytes of flash memory with read-while-write support
    • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface running up to 133 MHz
    • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND flash memory clocked up to 125 MHz in Synchronous mode
    • CRC calculation unit
  • 安保
    • ROP, PC-ROP, active tamper
  • General-purpose input/outputs
    • Up to 168 I/O ports with interrupt capability
  • Reset and power management
    • 3 separate power domains which can be independently clock-gated or switched off:
      • D1: high-performance capabilities
      • D2: communication peripherals and timers
      • D3: reset/clock control/power management
    • 1.62 to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
    • Embedded regulator (LDO) to supply the digital circuitry
    • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
    • Voltage scaling in Run and Stop mode (6 configurable ranges)
    • Backup regulator (~0.9 V)
    • Voltage reference for analog peripheral/VREF+
    • 1.2 to 3.6 V VBAT supply
    • Low-power modes: Sleep, Stop, Standby and VBAT supporting battery charging
  • Low-power consumption
    • VBAT battery operating mode with charging capability
    • CPU and domain power state monitoring pins
    • 2.95 µA in Standby mode (Backup SRAM OFF, RTC/LSE ON)
  • Clock management
    • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
    • External oscillators: 4-48 MHz HSE, 32.768 kHz LSE
    • 3× PLLs (1 for the system clock, 2 for kernel clocks) with Fractional mode
  • Interconnect matrix
  • 4 DMA controllers to unload the CPU
    • 1× high-speed master direct memory access controller (MDMA) with linked list support
    • 2× dual-port DMAs with FIFO
    • 1× basic DMA with request router capabilities
  • Up to 35 communication peripherals
    • 4× I2Cs FM+ interfaces (SMBus/PMBus)
    • 4× USARTs/4x UARTs (ISO7816 interface, LIN, IrDA, up to 12.5 Mbit/s) and 1x LPUART
    • 6× SPIs, 3 with muxed duplex I2S audio class accuracy via internal audio PLL or external clock, 1x I2S in LP domain (up to 150 MHz)
    • 4x SAIs (serial audio interface)
    • SPDIFRX interface
    • SWPMI single-wire protocol master I/F
    • MDIO Slave interface
    • 2× SD/SDIO/MMC interfaces (up to 125 MHz)
    • 2× CAN controllers: 2 with CAN FD, 1 with time-triggered CAN (TT-CAN)
    • 2× USB OTG interfaces (1FS, 1HS/FS) crystal-less solution with LPM and BCD
    • Ethernet MAC interface with DMA controller
    • HDMI-CEC
    • 8- to 14-bit camera interface (up to 80 MHz)
  • 11 analog peripherals
    • 3× ADCs with 16-bit max. resolution (up to 36 channels, up to 3.6 MSPS)
    • 1× temperature sensor
    • 2× 12-bit D/A converters (1 MHz)
    • 2× ultra-low-power comparators
    • 2× operational amplifiers (7.3 MHz bandwidth)
    • 1× digital filters for sigma delta modulator (DFSDM) with 8 channels/4 filters
  • Graphics
    • LCD-TFT controller up to XGA resolution
    • MIPI DSI host including an MIPI D-PHY to interface with low-pin count large displays
    • Chrom-ART graphical hardware Accelerator (DMA2D) to reduce CPU load
    • Hardware JPEG Codec
  • Up to 22 timers and watchdogs
    • 1× high-resolution timer (2.1 ns max resolution)
    • 2× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input (up to 240 MHz)
    • 2× 16-bit advanced motor control timers (up to 240 MHz)
    • 10× 16-bit general-purpose timers (up to 240 MHz)
    • 5× 16-bit low-power timers (up to 240 MHz)
    • 4× watchdogs (independent and window)
    • 2× SysTick timers
    • RTC with sub-second accuracy and hardware calendar
  • Debug mode
    • SWD & JTAG interfaces
    • 4-Kbyte embedded trace buffer
  • True random number generators (3 oscillators each)
  • 96-bit unique ID

STM32H747ZI引脚图

STM32H747ZI

STM32H747ZI 3D图

STM32H747ZI

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STM32H747ZI产品参数_产品符号_原装销售


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