首页 > 模块> LBEE59B1LV
名称 参数
产品分类 连接模块
Grade Consumer
Wi-Fi Wi-Fi 4
Chipset CYW43012
Package Shielded Resin
Platform Linux,WICED,Modus,i.MX Yocto,MCUXpresso
Bluetooth 5.0 BR/EDR/LE 2MPHY
Dimension 10.0 x 7.2 x 1.4 mm
Frequency 2.4GHz, 5GHz
Packaging Tape and Reel
Processor No
Type Name Type 1LV
RoHS对应 Yes
Technology Wi-Fi,Bluetooth
ETSI Report Yes
Mounting Type SMT
IC Manufacturer Infineon
FCC/IC Certified Yes
Interface Voltage 1.8V
Integrated Antenna No
Peripheral Interface PCM/I2S
Receive Mode Current 20mA @ 78Mbps (5GHz)
MIC (Japan) Certified Yes
Host Interface (Wi-Fi) SDIO
Host Interface (Bluetooth) UART
Operating Temperature (degC) -20℃ to 70℃
Transmit Mode Current (Wi-Fi) 200mA @ 11b (2.4GHz)<br>150mA @ 11g (2.4GHz)<br>140mA @ 11n (2.4GHz)<br>230mA @ 11a (5GHz)<br>210mA @ 11n (5GHz)<br>190mA @ 11ac (5GHz)
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