首页 > 模块> LBEE5KL1DX-626
名称 参数
产品分类 连接模块
Grade Consumer
Wi-Fi Wi-Fi 4
Chipset CYW4343W
Package Shielded Resin
Platform STM32Cube
Bluetooth 5.1 BR/EDR/LE
Dimension 6.95 x 5.15 x 1.1 mm
Frequency 2.4GHz
Packaging Tape and Reel
Processor No
Type Name Type 1DX-SPI
RoHS对应 Yes
Technology Wi-Fi,Bluetooth
ETSI Report Yes
Mounting Type SMT
Supply Voltage 3V to 4.8V
IC Manufacturer Infineon
FCC/IC Certified Yes
Interface Voltage 1.8V,3.3V
Integrated Antenna No
Peripheral Interface PCM
Receive Mode Current 47mA @ 11Mbps (2.4GHz)<br>47mA @ 54Mbps (2.4GHz)<br>47mA @ 65Mbps (2.4GHz)
MIC (Japan) Certified Yes
Host Interface (Wi-Fi) SPI
Host Interface (Bluetooth) UART
Operating Temperature (degC) -30℃ to 70℃
Transmit Mode Current (Wi-Fi) 320mA @ 11Mbps<br>270mA @ 54Mbps<br>260mA @ 65Mbps
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